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5 Busbar

Efficiency
23,1 %
Peak Power
5,64 Wp
Bifaciality factor*
93 %
Temperature Coefficient
-0,3 %/°С
Standard dimensions
156,75 х 156,75 mm
High quality N-type wafers
Busbarless design**
LID free
*Bifaciality factor = ratio between front and rear power оutput.
**Smartwire technology is recomended for cells interconnection. Basburs attached using Electrically Conductive Adhesive are also applicable.
Cell Specification

Specifications 5 Busbar

Electrical parameters at STC

Cell Bin A1 A2 A3 A4 A5  
Efficiency, % 23,1 22,9 22,7 22,5 22,3  
Pmpp, Wp 5,64 5,58 5,54 5,49 5,45  
Isc, A 9,17 9,12 9,10 9,07 9,06  
Voc, V 0,735 0,735 0,732 0,732 0,73  
Impp, A 8,63 8,65 8,65 8,61 8,58  
Vmpp, V 0,654 0,645 0,640 0,638 0,635  
Fill factor, % 83,71 83,53 83,15 82,89 82,54  

Dimensions and weight

Temperature coefficients

Temperature Coefficient, Vос
-0,262 %/°С
Temperature Coefficient, Isc
0,034 %/°С
Temperature Coefficient, Pmax
-0,297 %/°С

Other Hevel products

Connection type

SmartWire
  • Technology
    Heterojunction
  • Dimensions (mm)
    156,75 х 156,75