SmartWire

Efficiency
to 23,5 %
Peak Power
to 5,73 Wp
Bifaciality factor*
93 %
Temperature Coefficient
-0,31 %/°С
Standard dimensions
156,75 х 156,75 mm
High quality N-type wafers
Busbarless design**
LID free
*Bifaciality factor = ratio between front and rear power оutput.
**Smartwire technology is recomended for cells interconnection. Basburs attached using Electrically Conductive Adhesive are also applicable.
Cell Specification

Specifications SmartWire

Electrical parameters at STC

Cell Bin A0 A1 A2 A3 A4 А5
Efficiency, % 23,5 23,3 23,1 22,9 22,7 22,5
Pmpp, Wp 5,73 5,67 5,63 5,58 5,54 5,49
Isc, A 9,29 9,25 9,25 9,22 9,22 9,20
Voc, V 0,741 0,737 0,738 0,737 0,736 0,735
Impp, A 8,79 8,73 8,72 8,67 8,66 8,63
Vmpp, V 0,652 0,650 0,645 0,634 0,639 0,636
Fill factor, % 83,3 83,2 82,4 82,1 81,6 81,2

Dimensions and weight

Side
156,75 ± 0,25 mm
Angle
90 ± 0,3 °
4 chamfers
(8,5±0,5) х (45±0,3) °
Diagonal
Ø210 ± 0,25 mm
Weight
8,7 g
Thickness
0,13 ± 0,02 mm

Temperature coefficients

Temperature Coefficient, Vос
-0,249 %/°С
Temperature Coefficient, Isc
0,037 %/°С
Temperature Coefficient, Pmax
-0,311 %/°С

Power output by temperature

Other Hevel products

Connection type

5 Busbar
  • Technology
    Heterojunction
  • Dimensions (mm)
    156,75 х 156,75